Thermal​/Mechanical Engineering Intern

Thermal/Mechanical Engineering Intern

This role has been designed as 'Hybrid' with a requirement that you will work on average 2 days per week from an HPE office.

Who We Are:

Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next.

We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

We are seeking a motivated Thermal/Mechanical Engineering Intern to support the design, analysis, testing, and validation of next-generation server hardware. Working alongside experienced mechanical, thermal, electrical, firmware, and system engineers, the intern will help develop reliable cooling and mechanical solutions for compute-intensive platforms containing CPUs, GPUs, memory, storage, power supplies, and high-speed I/O devices. This role offers hands‑on exposure to server architecture, air and liquid cooling technologies, laboratory testing, engineering documentation, and cross‑functional product development.

• Support the mechanical and thermal development of rack‑mount server platforms, subsystems, and components.
• Assist with the design and evaluation of heat sinks, fans, air ducts, cold plates, brackets, sheet‑metal parts, and other cooling or structural hardware.
• Build and instrument server prototypes for thermal, airflow, acoustic, vibration, and mechanical testing.
• Measure component temperatures, system airflow, pressure, power, and environmental conditions using laboratory equipment and data‑acquisition tools.
• Execute documented test plans, maintain accurate test records, analyze results, and summarize findings in clear technical reports.
• Support workload and stress testing of CPUs, GPUs, DIMMs, drives, power supplies, and other heat‑generating components.
• Perform engineering calculations and assist with CAD, tolerance analysis, thermal modeling, CFD, or FEA under the guidance of senior engineers.
• Investigate test anomalies and prototype issues using structured troubleshooting and root‑cause methods.
• Participate in design reviews and collaborate with electrical, firmware, manufacturing, reliability, and supplier teams.
• Research emerging server‑cooling technologies, materials, and design practices, including air cooling and direct liquid cooling.
• Follow laboratory safety procedures, maintain an organized workspace, and contribute to continuous improvement of test methods and documentation.

• Currently pursuing a bachelor's or master's degree in Mechanical Engineering, Aerospace Engineering, or a related technical field.

• Completed coursework in heat transfer, thermodynamics, fluid mechanics, statics, mechanics of materials, or mechanical design.
• Fundamental understanding of conduction, convection, pressure drop, airflow, and mechanical load paths.
• Ability to apply engineering principles to practical problems and communicate results clearly.
• Basic proficiency with spreadsheets and technical presentations.
• Strong attention to detail, organization, curiosity, and willingness to work hands‑on in a laboratory environment.
• Ability to collaborate effectively in a multidisciplinary engineering team.

HPE is committed to creating an inclusive and accessible workplace and…