Hybrid Hardware Mechanical Engineer II - Design & Thermal
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Engineering
Job Description & How to Apply Below
Hewlett Packard Enterprise is seeking a Hardware Mechanical Engineer II to design mechanical and thermal hardware, electronics enclosures, and production tooling. This role emphasizes validation via tolerances, form/fit/function, and acoustics, with collaboration across internal and external teams.
Required are a Bachelors or Masters in Mechanical Engineering and 2–4 years of experience, with CREO and CFD/thermal analysis skills. Hybrid work arrangement with some in-office days.
We invite applications for the Hybrid Hardware Mechanical Engineer II - Design & Thermal position located in Spring, TX, United States.
The position is based in Spring, TX, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 63..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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