×
Register Here to Apply for Jobs or Post Jobs. X

RF Process Engineer: Die Attach & Wire Bonding

Job in Sedgefield, Stockton-on-Tees, Durham County, TS18 1AD, England, UK
Listing for: Filtronic
Full Time position
Listed on 2026-08-26
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 GBP Yearly GBP 60000.00 80000.00 YEAR
Job Description & How to Apply Below
Location: Sedgefield

Filtronic PLC is expanding its Process Engineering team at Net Park to scale advanced packaging and assembly of RF modules. The Process Engineer will evaluate, develop, optimise and control die attach and wire bonding processes, ensuring manufacturability and high yield for future products.

You will collaborate with RF, mechanical and operations teams, define tooling and automation needs, run feasibility trials, and drive continuous improvement through SPC, DMAIC and robust validation.

#J-18808-Ljbffr
Note that applications are not being accepted from your jurisdiction for this job currently via this jobsite. Candidate preferences are the decision of the Employer or Recruiting Agent, and are controlled by them alone.
To Search, View & Apply for jobs on this site that accept applications from your location or country, tap here to make a Search:
 
 
 
Search for further Jobs Here:
(Try combinations for better Results! Or enter less keywords for broader Results)
Location
Increase/decrease your Search Radius (miles)
0
200
Filters
Education Level
Experience Level (years)
Posted in last:
Salary