RF Process Engineer: Die Attach & Wire Bonding
Listed on 2026-10-11
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Engineering
Process Engineer, Electronics Engineer, Manufacturing Engineer
Filtronic PLC is expanding its Process Engineering team at Net Park to scale advanced packaging and assembly of RF modules. The Process Engineer will evaluate, develop, optimise and control die attach and wire bonding processes, ensuring manufacturability and high yield for future products.
You will collaborate with RF, mechanical and operations teams, define tooling and automation needs, run feasibility trials, and drive continuous improvement through SPC, DMAIC and robust validation.
Our group is growing, and we are hiring a RF Process Engineer:
Die Attach & Wire Bonding in Sedgefield, England, United Kingdom.
Are you ready to take on the RF Process Engineer:
Die Attach & Wire Bonding role at Filtronic?
We would love to welcome a new RF Process Engineer:
Die Attach & Wire Bonding to our group in Sedgefield, England, United Kingdom.
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