Quality Reliability Engineer

We are seeking a product & component Reliability test engineer. In this role you will implement transceivers and corresponding components reliability test, and will investigate the failure mechanism of the mechanical, physical, chemical, and different stress factors that lead to a product or component, that no longer meets its criteria by systematically examining data and identifying root causes, defect detection and failure analysis to improve product or component performance.

We are seeking a product & component Reliability test engineer. In this role you will implement transceivers and corresponding components reliability test, and will investigate the failure mechanism of the mechanical, physical, chemical, and different stress factors that lead to a product or component, that no longer meets its criteria by systematically examining data and identifying root causes, defect detection and failure analysis to improve product or component performance.

• Work on optical transceivers’ qualification and reliability test (HTOL, uBDH, BDH, TC and ESD HBM, etc.) and identify failure modes, such as physical damage, connector damage, fiber breakage, power supply problems, electromagnetic interference (EMI), poor assembly, signal integrity issues, reflection, and crosstalk.
• Analyze environmental factors, such as temperature extremes, humidity and moisture, and external electromagnetic interference, and their impact on the transceivers’ failure.
• Identify transceiver manufacturing defects, quality control issues, improper termination or poor-quality connectors, and improper soldering or misalignment of components.
• Detect and analyze aging and worn-out key components (Tx & Rx) from degradation.
• Seek and understand root causes to diagnose and prevent failures in optical transceivers.
• Complete products qualification and reliability reports to comply with GR-468 requirement.
• Analyze failure mechanism to determining root causes using analytical technologies, knowledges and tools.
• Quality Improvement - debugging and writing procedures related to production and field returns. Monitoring products & components performances and correlating issues to improve production yield.
• Project Management - organizing and managing complex reliability test projects, coordinating with cross-functional teams.
• Communicate the analysis results and put forward corrective suggestions to correlative teams and departments.

• Bachelor's degree in engineering or a related field preferred Material Engineering/Science, Electronical Engineering, semiconductor, Material Engineering, Material Science, Physics, etc.
• Minimum of one years of semiconductor laser dies, semiconductor process monitoring, and photonic integration circuit quality control preferred
• Expected skills include exposure to various analytical techniques, such as SEM, EDS, XRD, FIB, TEM, etc.
• Experience in debugging and failure analysis techniques of prototypes and products
• Strong understanding of optical communication principles and standards
• Understanding of processes involved in optical chip and module assembly, alignment, and burn-in processes
• Excellent analytical and problem-solving capabilities including using analysis software and systems
• Knowledge of quality standards, regulations, and GR-468 Generic Reliability Assurance Requirements
• Excellent presentation and reporting skills, good organization and multi-tasking skills and excellent attention to details
• Self-motivation, dependability, and good team player who can work efficiently with minimal supervision

• This position will be on-site based in Sugar Land, Texas.

• Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual needs
• Employer matching on 401(k) deferrals
• Unused PTO payout at end of the year
• Relocation package available within US
• Immigration sponsor ships (Must be currently authorized to work in the US)

We do not accept unsolicited proposals from third-party recruiters or agencies. Contacting hiring managers directly may result in disqualification of submissions.