Senior Electron Microscopy Engineer

Texas, United States

Applied Optoelectronics, Inc. (AOI) is seeking a Senior Electron Microscopy Engineer to support semiconductor laser failure analysis, process troubleshooting, and yield improvement.

The successful candidate will be a subject-matter expert in FIB, SEM, EDX/EDS, TEM/STEM, HRTEM, and electron diffraction, with strong expertise in advanced FIB sample preparation and semiconductor defect analysis. A key expectation of this position is the ability to identify structural defects, understand their formation mechanisms, and connect microscopy observations to semiconductor materials, fabrication processes, device performance, and reliability.

• Perform advanced electron microscopy analysis using FIB, SEM, EDX/EDS, TEM/STEM, HRTEM, and electron diffraction to identify defects, interfaces, compositional abnormalities, and failure mechanisms.
• Develop advanced FIB sample-preparation methods, including site-specific cross-sectional TEM lamella preparation, plan-view TEM preparation, low-damage thinning, and preparation of challenging semiconductor device structures.
• Analyze crystallographic and process-induced defects such as dislocations, stacking faults, interface defects, regrowth defects, contamination, and other microstructural abnormalities, with emphasis on understanding their formation mechanisms and process origins.
• Correlate microscopy results with epitaxy, wafer-fabrication processes, device performance, reliability testing, and yield data to support root-cause analysis and process improvement.
• Oversee microscopy laboratory operations, equipment performance, analytical methods, and sample-preparation capabilities.
• Develop and maintain SOPs and analytical procedures, and train technicians and engineers in microscopy operation, sample preparation, and data interpretation.
• Collaborate with Process Engineering, Epitaxy, Yield, Reliability, Quality, and R&D teams to investigate product failures and manufacturing issues.
• Work with equipment vendors, universities, and external laboratories to introduce advanced microscopy technologies and expand analytical capability.
• Prepare technical reports and clearly present analysis results, defect mechanisms, root-cause conclusions, and recommendations to technical teams and management.

• Ph.D. in Materials Science, Physics, Electrical Engineering, or a related field with 5+ years of relevant industrial experience, or equivalent industrial experience demonstrating comparable technical expertise.
• Recognized expertise in advanced electron microscopy, including FIB, SEM, EDX/EDS, TEM/STEM, HRTEM, and electron diffraction, with deep hands-on experience in advanced FIB sample preparation such as plan-view TEM specimens and site-specific cross-sectional lamellae.
• Strong knowledge of crystallography, semiconductor defects, and defect-formation mechanisms, with demonstrated ability to identify defects and determine their likely materials or process origins.
• Strong knowledge of semiconductor devices and manufacturing processes, preferably compound semiconductor lasers, including epitaxy, e-beam lithography, photolithography, wet and dry etching, PVD, CVD, metallization, and epitaxial regrowth.

• Experience with InP, In Ga As , In Ga As P, DFB lasers, EMLs, quantum-well structures, buried heterostructures, and semiconductor laser failure analysis is highly desirable.