Process & Quality Engineer — Die Attach & Wire Bonding
Listed on 2026-10-07
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Engineering
Quality Engineering, Process Engineer
Pyramid Semiconductor, part of the HEICO group, seeks a hands-on Process/Quality Engineer to strengthen and continuously improve semiconductor assembly processes, with emphasis on die attach and wire bonding. The role involves collaborating with engineering, operations, and quality to sustain reliable devices and uphold quality systems.
You will contribute to ISO 9001 and AS9100 compliance, perform audits, lead root-cause investigations, and drive continuous improvement in a lean, small-team
As a Process & Quality Engineer — Die Attach & Wire Bonding, you will play an important part at HEICO in Sunnyvale, CA, United States.
The position is based in Sunnyvale, CA, United States.
This opportunity is part of our work in Management & Operations, Engineering.
The advertised compensation is 90..
We aim to respond to suitable candidates as soon as possible.
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