Lead Silicon Photonics Packaging Engineer
Listed on 2026-11-04
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Engineering
Packaging Engineer, Electronics Engineer, Systems Engineer
NOKIA is seeking a Packaging Development Engineer in Sunnyvale, California, to lead the design of next-generation packaging solutions for optical technologies. In this role, you will innovate and collaborate with cross-functional teams on key processes like flip chip and reflow.
Your expertise in high-speed electronics packaging and problem-solving will drive the development to ensure seamless mass production of advanced optical packages. If you have strong communication skills and a passion for technology, we encourage you to apply!
This is a great opening to take on the Lead Silicon Photonics Packaging Engineer role at NOKIA.
The advertised compensation is 100..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Lead Silicon Photonics Packaging Engineer role in the description above.
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