Principal Mechanical Engineer

This role has been designed as Onsite with an expectation that you will primarily work from an HPE office.

Who We Are:

Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next.

We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

• Develop and own structural FEA simulation capabilities to support multiple ongoing NPI projects as well as sustaining issues as they arise
• Improve simulation accuracy continuously through test correlation and model refinement
• Maintain and coordinate multiple FEA projects done by yourself, other internal functions, as well as external partners
• Drive and review FEA simulation efforts by component suppliers and ODMs
• Participate from Concept phase to provide design guidance by running FEA studies on areas of concern
• Act as the main point of contact for all mechanical-related issues that arise from MDVT and HALT and lead issue resolution by validating design changes through simulation and/or test
• Design and prototype chassis and fixture for testing
• Become the in-house expert in strain gauge applications and accelerometer measurements during MDVT and HALT
• Conduct thorough processing and analysis of test data including microstrain, G-levels, and ASIC temperatures throughout MDVT and HALT
• Document tests and FEA simulations, including static loading, modal analysis and dynamic, in each NPI project’s design review and be responsible for the system’s structural integrity
• Communicate recommended design changes effectively to HW leads with strong justification backed by FEA model results
• Collaborate with ASIC development team to generate 3D models of ASICs based on package outline drawings including BGAs and conduct near-package or co-package connector placement and floorplan studies as required
• Support manufacturing and operations’ efforts to improve production yield by performing FEA studies or running limited design of experiments in lab
• Provide mechanical design and structural analysis support across multiple product development programs, including chassis design, packaging, reliability, and manufacturability.
• Participate in hands‑on engineering activities, including CAD design and reviews, tolerance analysis, prototyping, testing, and root‑cause investigations.
• Collaborate with cross‑functional teams and suppliers to identify technical risks, resolve design and manufacturing issues, and implement corrective actions.
• Contribute to mechanical specifications, design guidelines, validation plans, and engineering best practices.
• Provide project scoping, resource estimates, schedule input, and technical guidance for new product development efforts.

• 10+ years of experience in electromechanical product development.
• MS in Mechanical Engineering, Applied Physics or equivalent.
• Experience developing networking, server, storage, telecommunications, or high-performance computing systems.
• Extensive experience with chassis development, system packaging, and high-density electronic assemblies.
• Experience in FEA and familiarity with ANSYS Workbench, including static‑structural, modal analysis, transient mode superposition, Eigenvalue‑Buckling, and steady‑state thermal,…