Hybrid Mechanical Hardware Engineer – Enclosures & Thermal
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Engineering
Mechanical Engineer
Job Description & How to Apply Below
Hewlett Packard Enterprise in Sunnyvale, CA is seeking a Mechanical Hardware Engineer I Graduate to design mechanical and thermal hardware, electronics enclosures, and tooling. You will support test plans and validation while collaborating with internal and outsourced partners to deliver reliable, cost-effective solutions.
The role targets recent BS or MS graduates in Mechanical Engineering with hands-on CAD experience, including Pro Engineer, and a strong grasp of heat transfer and production
The following opening is for a Hybrid Mechanical Hardware Engineer I – Enclosures & Thermal with Hewlett Packard Enterprise.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Sunnyvale, CA, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 65.000 - 90.000.
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