Senior IC Layout Lead; .5D/3D-IC)
Listed on 2026-10-30
-
Engineering
Packaging Engineer, Electronics Engineer, Systems Engineer
Annapurna Labs, an AWS organization, is seeking a Sr. Package Layout Engineer to lead end-to-end physical design of advanced IC packages for data center accelerators.
You will own package layout from floor planning to tape-out, driving 2.5D/3D-IC and interposer architectures with cross-functional teams. Expect to collaborate with silicon, SI/PI, thermal and manufacturing groups to meet performance, density and reliability targets.
For the Senior IC Package Layout Lead (2.5D/3D-IC) position at Amazon Inc., we are reviewing applications now.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in AZ, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 150..
We aim to respond to suitable candidates as soon as possible.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).