Senior Power Package Design Lead
Listed on 2026-11-01
-
Engineering
Packaging Engineer, Electronics Engineer
Renesas Electronics Corp. seeks an experienced semiconductor packaging leader to drive technology development and NPI execution for power SiP/modules and high‑reliability interconnect solutions.
You will collaborate with OSATs, suppliers, and internal teams to meet schedule, cost, and quality targets. The role requires 12–15 years in package development, with a strong background in wafer‑level packaging, flip‑chip, and power packaging technologies.
We are looking to fill the Senior Power Package Design Lead position at Renesas Electronics Corp. in AZ, United States.
The Senior Power Package Design Lead role at Renesas Electronics Corp. is now open for applications in AZ, United States.
Join us at Renesas Electronics Corp. as our next Senior Power Package Design Lead in AZ, United States.
We are currently recruiting a Senior Power Package Design Lead for our team in AZ, United States.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).