Photonics Packaging & Testing Intern

Swiss Photonics Integration Center (Swiss PIC) provides precision assembly and characterization solutions for Swiss industry, especially start‑ups and SMEs. High‑speed systems are widely demanded in optical communications, sensing, quantum computing, and testing and qualification are crucial steps to verify product performance. The center is located in the Switzerland Innovation Park InnovAARE, next to the Paul Scherrer Institute (PSI), and is investing in qualified industrialized processes, clean environmentally controlled fabs, high‑tech machinery, and a full production line for optical and electrical precision assembly.

The Opportunity: We are seeking an intern to contribute to photonic packaging and testing services for a minimum duration of four months. If you are experienced in optical and/or RF characterization and packaging, or familiar with related lab equipment, you are highly encouraged to apply. Otherwise, an openness to learn and readiness to tackle the task at hand while learning from our experienced specialists is a must.

Join our international and dynamic team of experts dedicated to pushing the boundaries of what is possible in photonics and shaping the future of technologies in communication, computing, quantum, and beyond.

• Systematic test and iteration on interface designs, using state‑of‑the‑art tools and methodologies to extract best designs for high‑frequency interfacing
• Characterize and qualify the developed solutions and document the results
• Closely collaborate with the design and process engineering teams to develop and improve solutions that meet performance requirements and manufacturing constraints
• Provide clear and timely reporting to Swiss PIC experts

• Bachelor, master, or PhD in Electrical Engineering, Physics, or a related field
• Hands‑on experience with optical or RF characterization equipment such as tunable lasers, OSAs, power meters, VNAs, or LCAs is a plus
• Experience with chip facet polishing tools is a plus
• Technical documentation skills and systematic reporting; self‑motivated and able to work independently
• Strong analytical and problem‑solving skills, with the ability to troubleshoot complex issues and propose effective solutions
• Experience with semiconductor packaging, microelectronics or micromechanics is a plus
• Solid communication skills in English required

• Opportunity to work on groundbreaking technology at the forefront of the industry, shaping the future of communication and computing
• International, collaborative and inclusive team culture that values creativity, diversity, and continuous learning
• Personal responsibility in your job and the chance to grow with us
• Our passion to bring PICs to everyday life

Employment rate: 60% or by arrangement;
Place of work: Villigen, Switzerland;
Start date: from June 2026;
Duration: at least four months

How to Apply: We look forward to receiving your application, including:

• Your CV
• (Optional) A statement of interest relating the position to your skills
• (Optional) Grades or work certificates, or references if available

Applications will be reviewed on a rolling basis.