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Senior Technologist - Microelectronics

Job in City of Syracuse, Syracuse, Onondaga County, New York, 13201, USA
Listing for: TTM Technologies
Full Time position
Listed on 2026-01-01
Job specializations:
  • Engineering
    Systems Engineer, Electrical Engineering
Job Description & How to Apply Below
Location: City of Syracuse

About TTM

TTM Technologies, Inc.

- Publicly Traded US Company, NASDAQ (TTMI) - Top-5 Global Printed Circuit Board Manufacturer

TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market.

Additional information can be found at

Sr Technologist Microelectronics is responsible for leading future technology development in the discipline of Microelectronic components, and packages. Drive heterogeneous integration strategies combining multiple die types (logic, memory, RF, sensors, photonics) in advanced package configurations in System in package and Multichip modules. Provide mentorship to engineering staff and senior principal engineers. Build and maintain relationships with external partners. Contribute to capture strategy development and define complex design architectures.

Possess deep knowledge of state-of-the-art analysis tools and techniques. Evaluate existing processes and technology capabilities, anticipate emerging technologies, and assess their applicability to TTM's portfolio. Apply forward-thinking approaches to technology planning and roadmap development. Define and lead R&D programs that advance technology objectives, including performing technical research. Support advanced proposal efforts and guide strategic technology initiatives.

Duties and Responsibilities Technical Leadership & Project Management
  • Lead the design, development, and implementation of advanced packaging solutions including 2.5D/3D IC packaging, flip-chip, wafer-level packaging (WLP), fan-out packaging, and chiplet-based architectures
  • Provide technical leadership and guidance to engineering teams, mentoring lower-level engineers and supervising direct reports as required
  • Lead or assist with technical proposal efforts, white papers, and trade analyses
  • Determine program technical objectives, requirements, standards, and project milestones to ensure compliance with specifications, schedule, and cost requirements
Technical Expertise and Problem Solving
  • Perform scientific research and complex mathematical analysis, Possess expert knowledge in Microelectronics manufacturing
  • Design, test, and verify products, concepts, specifications, devices, and systems with a high degree of creativity, foresight, and judgment
  • Identify and analyze design problems to achieve optimal solutions using internal and external resources
  • Develop innovative approaches to solve complex technical problems
Strategic Planning and Innovation
  • Stay current on technology, customer roadmaps, and industry trends
  • Collaborate with cross-functional teams (design, measurement, business development, manufacturing, quality) to develop new products and technologies
  • Define capabilities required to meet current and future needs and execute plans to achieve them
  • Understand and communicate technologies and products from key suppliers
Communication and Collaboration
  • Interface effectively with internal teams and external stakeholders (customers and suppliers)
  • Communicate critical technical information regarding design, measurement, performance, specifications, schedule, and cost
  • Pursue continuing education to broaden engineering knowledge, improve effectiveness, and avoid technical obsolescence
  • Travel occasionally as necessary
Job Knowledge,

Skills and Abilities

Technical Leadership and Problem Solving
  • Provide technical leadership for engineering projects with substantial complexity and scope
  • Expert in engineering design, measurement, and analysis software tools
  • Design and solve extremely complex engineering problems with minimal assistance
  • Draw conclusions and make recommendations based on technical inputs from multiple functions (Manufacturing, Quality, Regulatory, etc.)
Communication and Collaboration
  • Communicate clearly and effectively with cross-functional team members
  • Effective delegation skills
  • Work independently and as part of a team
Project and Process Management
  • Manage multiple priorities in a changing environment
  • Assist with process improvements and cost reduction initiatives
Professional Development
  • Actively pursue opportunities to expand job-related knowledge
  • Produce whitepapers and other technical publications

Must have a background that would permit the U.S. Department of Defense to issue a Secret clearance when necessary for work on a project that requires such a clearance

Minimum Education and Experience
  • Education:

    Bachelor's Degree, in Bachelor's degree in Electrical Engineering, Materials Science, Physics, or related field;
    Master's degree/PhD Preferred
  • Experience:

    Minimum 20 years' relevant experience.
Compensation and Benefits

TTM offers a variety of health and well-being benefit programs. Benefit options…

Position Requirements
10+ Years work experience
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