Senior Mechanical Engineer, Electronic Packaging & FEA Lead
Listed on 2026-10-06
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Engineering
Mechanical Engineer, Product Engineer, Packaging Engineer, Electronics Engineer
TTM Technologies, Inc. is seeking an experienced Mechanical Engineer to design, analyze and qualify electronics packaging for commercial, defense and space products. You will lead mechanical design efforts, perform FEA and thermal analyses, and collaborate across engineering teams.
Responsibilities include evaluating design trade-offs, developing qualification plans, and mentoring junior staff while ensuring customer requirements are met and standards are followed.
We are looking to fill the Senior Mechanical Engineer, Electronic Packaging & FEA Lead position at TTM Technologies in City of Syracuse, NY, United States.
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This posting is for the Senior Mechanical Engineer, Electronic Packaging & FEA Lead role at TTM Technologies, based in City of Syracuse, NY, United States.
The Senior Mechanical Engineer, Electronic Packaging & FEA Lead role at TTM Technologies is now open for applications in City of Syracuse, NY, United States.
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