Staff Engineer – Microelectronics Packaging Technology

About TTM TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency(“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards(“PCB”s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Additional information can be found at

As a Staff Engineer – Microelectronics Packaging Technology, you will be part of a multidisciplinary advanced technology team developing highly integrated System-In-Packages (SiP) and module sub-systems for Aerospace, Defense, Industrial, medical use cases. You will be an individual contributor with subject matter expertise to design and layout heterogeneously integrated SiP packages, analyze thermal and mechanical behavior, and support development of SiP design infrastructure.

This is an excellent opportunity to work across full spectrum of technology development cycle from conceptualization (early TRLs) to manufacturing readiness (mid-MRLs). This role calls for an individual to provide in‑depth engineering analysis, model‑based engineering problem solving, and collaborate cross‑functionally. You will interface closely with teams across internal manufacturing, operations, business units, external material suppliers, and process vendors. The successful candidate will foster technology‑driven thinking for differentiation, but manufacturing‑informed for design packaging solutions.

• Lead the design and development of advanced SiPs and module package solutions using 2D/3D packaging technologies with 50micron to 130micron flip‑chip interconnects, WLP bumped die, and embedded die.
• Provide technical leadership in support of package architecture selection by generating 3D package designs, manufacturability, and risk assessments.
• Generate and optimize detailed package designs in 3D environment using SOLIDWORKS. This will be done in collaborate with RF/MW/electrical engineering teams
• Perform complex physics‑based mechanical and vibration simulations for SiP configurations using FEM tools (ANSYS) to analyze chip‑package interaction, package‑board interaction, warpage, stress, and reliability risks.
• Perform SiP‑level thermal simulations for microelectronics packages using FEM tools (ANSYS)
• Define and assist in the buildup of SiP design infrastructure that includes package design flows, 3D modeling and simulation methodologies, generating package design rules.
• Lead or assist in writing white papers, technical proposals, and conference publications.
• Benchmark industry best practices and evaluate emerging technologies for package design, assembly materials, and process innovations.
• Perform and collate tradeoff analysis on ambiguous problems that considers interdisciplinary nature of semiconductor packages.
• Communicate complex technical concepts effectively to cross‑functional project teams, operations, suppliers, business teams
• Be creative in designing and developing innovative integration methods that foster the spirit of differentiation and generation of IPs
• Assist in project management by providing planning inputs for defining packaging tasks, schedule, and cost.

• Must possess a strong knowledge across broad spectrum of packaging technology landscape from component packaging to heterogeneously integrated SiPs.
• Must possess good understanding in various packaging elements such as substrate technologies, silicon…