Staff Engineer, SiP & Microelectronics Packaging
Listed on 2026-10-12
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Engineering
Electronics Engineer, Packaging Engineer, Systems Engineer
TTM Technologies, Inc. is seeking a Staff Engineer - Microelectronics Packaging Technology to join our advanced technology team.
You will design and layout highly integrated SiP packages, analyze thermal and mechanical behavior, and support the development of SiP design infrastructure across aerospace, defense, and industrial applications. You will lead 3D package designs in SOLIDWORKS, perform FEM simulations in ANSYS, evaluate manufacturability, and contribute to white papers and proposals
We would love to welcome a new Staff Engineer, SiP & Microelectronics Packaging to our group in City of Syracuse, NY, United States.
The Staff Engineer, SiP & Microelectronics Packaging role at TTM Technologies, Inc. is now open for applications in City of Syracuse, NY, United States.
Join us at TTM Technologies, Inc. as our next Staff Engineer, SiP & Microelectronics Packaging in City of Syracuse, NY, United States.
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