Senior Staff Engineer, Microelectronics Packaging & SiP
Listed on 2026-10-13
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Engineering
Electronics Engineer, Packaging Engineer
TTM Technologies, Inc. in the United States is seeking a Staff Engineer – Microelectronics Packaging Technology to lead design of advanced SiPs and module packages, with 50-130 micron flip-chip interconnects, WLP bumped die, and embedded die.
You will assess manufacturability and provide 3D designs using SOLIDWORKS. You will run FEM simulations in ANSYS to evaluate chip-package and package-board interactions, heat flow, and reliability; develop design infrastructure; and collaborate with
The Senior Staff Engineer, Microelectronics Packaging & SiP role at ttmtechnologies is now open for applications in City of Syracuse, NY, United States.
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This posting is for the Senior Staff Engineer, Microelectronics Packaging & SiP role at ttmtechnologies, based in City of Syracuse, NY, United States.
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