Staff Engineer – Advanced SiP Packaging & Thermal Design
Listed on 2026-10-15
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Engineering
Mechanical Engineer, Packaging Engineer, Electronics Engineer, Systems Engineer
TTM Technologies, Inc. seeks a Staff Engineer – Microelectronics Packaging Technology to advance SiP and module sub-systems for aerospace, defense, and industrial applications.
You will develop heterogeneous SiP packages, analyze mechanical and thermal behavior, and support infrastructure for design and testing, collaborating across manufacturing, operations, and suppliers. You will lead 3D packaging design activities, evaluate manufacturability, and contribute to white papers and technical
For the Staff Engineer – Advanced SiP Packaging & Thermal Design position at TTM Technologies, Inc., we are reviewing applications now.
This opportunity is part of our work in Engineering.
The advertised compensation is 101..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Staff Engineer – Advanced SiP Packaging & Thermal Design role in the description above.
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