Senior Mechanical Engineer, Electronic Packaging & FEA Lead
Listed on 2026-11-04
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Engineering
Mechanical Engineer, Packaging Engineer, Product Engineer
TTM Technologies, Inc. is seeking an experienced Mechanical Engineer to design, analyze and qualify electronics packaging for commercial, defense and space products. You will lead mechanical design efforts, perform FEA and thermal analyses, and collaborate across engineering teams.
Responsibilities include evaluating design trade-offs, developing qualification plans, and mentoring junior staff while ensuring customer requirements are met and standards are followed.
We are currently recruiting a Senior Mechanical Engineer, Electronic Packaging & FEA Lead for our team in City of Syracuse, NY, United States.
Join us at TTM Technologies as our next Senior Mechanical Engineer, Electronic Packaging & FEA Lead in City of Syracuse, NY, United States.
This is a genuine position to take on the Senior Mechanical Engineer, Electronic Packaging & FEA Lead role at TTM Technologies.
As a Senior Mechanical Engineer, Electronic Packaging & FEA Lead, you will play an important part at TTM Technologies in City of Syracuse, NY, United States.
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