Engineer, Design Amkor Technology Enabling

Amkor Technology is currently hiring an IC package Design Engineer for its Tempe, AZ location. This position requires the ability to create high-quality IC package designs and detailed engineering drawings and help sustain multiple design-related activities within the Design Center.

• Design Laminate (BGA) and Wafer Level packages, determining design rules, design optimization/verification, and selecting package type for thermal, mechanical, and electrical aspects
• Create detailed engineering drawings with little supervision
• Utilize skills and experience to solve design problems and customer issues
• Seek out opportunities to improve and advance design technology
• Exercise responsibility when making design-related decisions
• Create and sustain effective, productive, and quality partnerships between the design team and customers
• Interact with Amkor Product Group & Sales teams to ensure customer requirements are met; interface with internal and external customers as required
• Create documentation and perform record-keeping
• Lead by example while learning
  
  Other duties as assigned

This position requires a bachelor’s degree in Electrical Engineering, Mechanical Engineering, or other relevant engineering disciplines.

• Demonstrated experience using CAD or equivalent software to create engineering drawings
• Excellent verbal and written communication skills required
• Demonstrates the ability to efficiently complete tasks with minimal supervision
• Must be self-motivated and team-oriented with the ability to meet aggressive schedules and be able to work well in a team environment
• Semiconductor packaging experience is a plus
• Experience using package design and simulation tools (Cadence APD, Cadence Sigrity, Siemens Expedition, Ansys HFSS, and CAM
  350) is desired
• PCB design experience is a plus
• Working knowledge of GD&T practices is helpful
• SI/PI experience is a plus