Senior Substrate Process Engineer | Equity & Packaging
Listed on 2026-10-11
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Engineering
Process Engineer, Packaging Engineer, Manufacturing Engineer, Quality Engineering
Syenta is seeking a Senior Process Engineer (Substrate) to support the development of our advanced packaging toolset. You will develop PID coating and patterning processes, wafer-level processing including photolithography, etching, thin-film deposition, wet processing, and metrology verification, translating prototypes into scalable manufacturing solutions.
You will collaborate across substrate build-up, microfabrication, and characterization, contributing to next-generation device production
For the Senior Substrate Process Engineer | Equity & Packaging position at Syenta, we are reviewing applications now.
We are currently recruiting a Senior Substrate Process Engineer | Equity & Packaging for our team in Tempe, AZ, United States.
This is a great role to take on the Senior Substrate Process Engineer | Equity & Packaging role at Syenta.
As a Senior Substrate Process Engineer | Equity & Packaging, you will play an important part at Syenta in Tempe, AZ, United States.
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