Senior Package Design Engineer - Power & Chiplet
Listed on 2026-10-12
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Engineering
Electrical Engineering, Packaging Engineer
Renesas is seeking a Staff Package Design Engineer to join the Advanced Silicon Packaging team in Austin, TX or Tempe, AZ. You will design and deliver high-performance semiconductor package solutions, including power modules and chiplet-based architectures for automotive, industrial, IoT, and AI-enabled platforms.
The role requires deep expertise in package layout, manufacturability, assembly constraints, and cross-domain co-design with global teams.
The Senior Package Design Engineer
- Power & Chiplet Packages role at Renesas is now open for applications in Tempe, AZ, United States.
Join us at Renesas as our next Senior Package Design Engineer
- Power & Chiplet Packages in Tempe, AZ, United States.
We are currently recruiting a Senior Package Design Engineer
- Power & Chiplet Packages for our team in Tempe, AZ, United States.
This is a great position to take on the Senior Package Design Engineer
- Power & Chiplet Packages role at Renesas.
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