Power Packaging Design & NPI Lead
Listed on 2026-10-12
-
Engineering
Packaging Engineer
Renesas Electronics is seeking a senior leader to drive package technology development for AI and data center power products. You will coordinate with OSATs for new package development, qualification, and production transfer, while managing budgets and customer adoption programs.
The role requires extensive experience in power SiP/modules, wafer-level packaging, flip-chip methods, and advanced substrates, with a track record in leading cross-functional teams and delivering on aggressive
For the Power Packaging Design & NPI Lead position at Renesas, we are reviewing applications now.
We have an opening for a Power Packaging Design & NPI Lead in Tempe, AZ, United States within Engineering.
This role, Power Packaging Design & NPI Lead at Renesas, could be your next opportunity.
Are you ready to take on the Power Packaging Design & NPI Lead role at Renesas?
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).