Package Design Engineer: Advanced Silicon Packaging
Listed on 2026-10-15
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Engineering
Packaging Engineer, Electronics Engineer
Renesas Electronics Corp. seeks a Staff Package Design Engineer to join its Advanced Silicon Packaging team in Tempe, AZ or Austin, TX. You will design and deliver high-performance package solutions across automotive, industrial, IoT, and AI-enabled platforms.
The role requires hands-on CAD layout for power modules, FCBGA, SiP, and chiplet architectures, with collaboration across SI/PI, thermal, reliability, and silicon design teams. Bachelor's/Master's in EE or related field is expected.
Step into the Staff Package Design Engineer:
Advanced Silicon Packaging role at Renesas Electronics Corp. in Tempe, AZ, United States and grow with us.
Please review the full job details above before applying.
If your experience matches this role, we encourage you to apply.
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The position is based in Tempe, AZ, United States.
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