Senior Power Package Design & NPI Leader
Listed on 2026-10-17
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Engineering
Packaging Engineer
Renesas Electronics Corp. is seeking a senior packaging technology leader to drive development and NPI for power package solutions.
You will lead cross-functional teams with global OSAT partners, implement roadmaps, and manage budgets while ensuring product qualification and customer adoption. You will oversee SiP/module and wafer-level packaging initiatives, coordinate DOE activities, and drive robust process validation and transfer to production across multiple product lines.
This opening is for the Senior Power Package Design & NPI Leader role at Renesas Electronics Corp.
All applications are reviewed carefully by our team.
The position is based in Tempe, AZ, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 180..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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