Packaging Process Engineer

Sheba Microsystems is a Toronto-based high-technology company developing advanced MEMS-based micro-actuator solutions for high-performance camera applications. Our technology combines MEMS innovation, electronics, module assembly and precision manufacturing to enable next-generation imaging systems.

As Sheba Microsystems scales its product industrialization, manufacturing network and customer programs, we are looking for a Packaging Process Engineer to join our team.

This is a permanent, full-time position based at our Toronto, ON office
.

• Support the development, assembly, and evaluation of MEMS packages and compact camera modules in accordance with engineering drawings, work instructions, specifications, and assembly procedures.
• Develop, optimize, characterize, and qualify Chip-on-Board (COB) and related precision packaging and assembly processes for MEMS-based products, including die attach, adhesive dispensing, wire bonding, lid sealing, optical alignment, and final assembly, and support process transfer and industrialization with external manufacturing partners during NPI, process qualification, and production ramp.
• Investigate packaging, assembly, test, and reliability failures using structured root cause analysis and implement effective corrective and preventive actions.
• Apply engineering and quality tools, including DOE and statistical analysis, to improve process robustness, reproducibility and manufacturability using Failure Mode and Effects Analysis (FMEA), Control Plans, SPC, process capability analysis, and Measurement System Analysis (including Gage R&R).
• Operate laboratory equipment according to SOPs, manuals, methods, and risk assessments.
• Test and characterize MEMS devices and assembled products.
• Collaborate with electrical, optical, and software engineers to characterize, calibrate, and optimize the camera module.
• Perform dimensional measurements to verify products meet specifications.
• Contribute to our product plans with ideas for new products and continuous product and process improvements.
• Contribute to the technical plans by helping to define process, packaging, and industrialization milestones and technical risks.

• Bachelor's degree in Mechanical Engineering, Manufacturing Engineering, or a closely related engineering discipline.
• 2+ years of relevant experience in process engineering, precision manufacturing, semiconductor packaging, camera module assembly, or a related manufacturing environment.
• Hands-on experience with Chip-on-Board (COB), semiconductor packaging, or comparable precision assembly processes, including die attach, wire bonding, lid sealing, adhesive dispensing, and optical alignment.
• Experience investigating assembly, packaging, and reliability failures using structured root cause analysis and corrective and preventive actions.
• Knowledge of package materials, adhesives, mechanical and thermal stresses, moisture, package integrity, contamination control, and clean manufacturing practices
• Experience in validation, test, and characterization of precision assemblies, semiconductor packages, or compact camera modules.
• Familiarity with 3D CAD software such as Fusion 360, Solid Works, or equivalent.
• Strong written and verbal English communication skills, including clear technical documentation.

• Previous experience supporting NPI and mass production of camera module assembly, including familiarity with APQP/PPAP or similar industrialization methodologies.
• Extensive experience in wire bonding process optimization.
• Experience with MEMS reliability testing and package-level failure analysis.
• Ability to travel internationally as required to support manufacturing partners and customer programs.