Systems Intern - Validation, Software, Design, Architecture & Packaging

Tenstorrent is leading the industry on cutting‑edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC‑V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible.

We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

A chip isn’t a product until it’s a working system. These teams cover both ends of that: getting silicon to boot and validate correctly,building the board, power, mechanical, thermal, packaging and IO around it. You submit one application, you have one recruiter screen - then we match you to the specific team below and location that fits best.

• Systems & Silicon Validation: Post‑silicon testing of physical chips and integrated systems to ensure they meet all functional, electrical, and performance specs.
• System Software: Development of foundational software, including firmware, drivers, and operating systems, that directly controls and interfaces with hardware.
• System Design: The process of defining, integrating, and mapping out hardware components such as PCBs, software modules, and interfaces into a complete product blueprint.
• System Architecture: Define the high‑level structural framework, interfaces, and data‑flow pathways between the CPU, memory, and peripherals.
• Packaging: A package is what is placed between the silicon and the board; and its design requires detailed electrical, electromagnetic, and mechanical simulations and analysis.

This role is on‑site based out of Toronto, Ontario or Vancouver, British Columbia.

• Currently pursuing a BS, MS, or PhD in EE, Computer Engineering, Computer Science or Mechanical Engineering
• Coursework or projects in embedded systems, microwave and signal integrity, board‑level design, or thermal/mechanical engineering using low‑level programming (C/C++, Python) or hardware design and/or simulation tools (e.g., CAD, FEA, Verilog).
• Problem solver with strong foundational knowledge in one of these areas: electrical engineering, digital logic, computer architecture, or thermal/mechanical.
• Curious learner who is passionate about the intersection of software, silicon architecture, and the physical constraints of chip packaging and printed circuit boards (PCBs).

• Systems & Silicon Validation: Assist in post‑silicon testing of physical microchips under real‑world workloads to ensure they meet all functional, electrical, and performance specifications.
• System Software: Contribute to developing foundational software—including firmware, drivers, and operating systems that directly controls and interfaces with the semiconductor hardware.
• System Design & Architecture: Help map out, define, and evaluate high‑level structural frameworks, optimizing the power delivery and high‑speed performance benchmarks of both the silicon components and the underlying PCBs.
• Semiconductor Packaging & Mechanical Design: Design and layout, Electromagnetic (signal integrity and power integrity), mechanical design, and stress analysis

• Hands‑on silicon experience using industry‑standard lab equipment to bridge the gap between theoretical hardware design, physical packaging layouts, and real‑world chips.
• Low‑level software development by writing production‑grade firmware, device drivers, and diagnostic tools that run directly on bare metal.
• Mechanical…