Electromechanical Packaging Engineer

Job Location:

Torrance, CA 90503, Position Type:
Full Time, Salary Range: $ - $ Salary/year,

Job Purpose:

Navitas Semiconductor (Nasdaq: NVTS) is a next-generation power semiconductor leader driving innovation in gallium nitride (GaN) and high-voltage silicon carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI data centers, high-performance computing, energy and grid infrastructure, and industrial electrification.

With more than 30 years of combined expertise in wide bandgap technologies, GaNFast™ power ICs integrate GaN power, drive, control, sensing, and protection, delivering faster power delivery, higher system density, and greater efficiency. GeneSiC™ high-voltage SiC devices leverage patented trench-assisted planar technology to provide industry-leading voltage capability, efficiency, and reliability for medium-voltage grid and infrastructure applications.

We are seeking a Staff Electromechanical Packaging Engineer to join our fast-growing, collaborative team. The ideal candidate is self-motivated, energetic, and able to thrive in a high-growth, innovative environment, contributing directly to technologies that are shaping the future of power electronics.

• Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product line.
• Collaborate with substrate layout, ASIC design, and manufacturing engineers.
• Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components, assembly, and test.
• Work with OSAT (Out-Source Assembly and Test) suppliers in establishing process baseline from prototype to mass production.

• Understanding of how electrical design requirements impact substrate layout and interconnect selection
• Proficient with 3D mechanical CAD software (Creo, NX, Catia, etc.), generating mechanical drawings, and GD&T
• Ability to read and create electrical schematics
• Familiarity with tape out processes for wafers and substrate
• Basic understanding of Form, Fit, Function elements in design for manufacturability (DFM).
• willingness to learn new concepts and techniques and concepts
• Familiarity with PCB design tools (Altium, Cadence, Mentor, etc.) is a plus
• Basic understanding of component level thermal analysis is a plus

• Minimum BS in Mechanical or Electrical engineering, MS or higher-level degree preferred.
• 3+ years' experience with microelectronics packaging, and/or PCB design

• Knowledge of foundry processes and chip scale assembly processes