Principal SI/PI Design Engineer Speed Packaging
Listed on 2026-11-01
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Engineering
Electrical Engineering, Systems Engineer, Packaging Engineer, Electronics Engineer
USA Tech Recruit seeks an experienced Principal Signal Integrity / Power Integrity Design Engineer to lead advanced package design efforts for next-generation semiconductor products in New Jersey. This role involves overseeing package architecture, signal integrity, power integrity, and RF performance.
The ideal candidate will have a Bachelor's degree in Electrical Engineering or a related field, along with 5+ years of relevant experience. Strong expertise in high-speed electrical design principles is essential, along with proficiency in design tools such as Cadence APD and HFSS.
We are seeking a motivated Principal SI/PI Design Engineer — High‑Speed Packaging to join USA Tech Recruit in NJ, United States.
Consider building your career as a Principal SI/PI Design Engineer — High‑Speed Packaging at USA Tech Recruit.
The Principal SI/PI Design Engineer — High‑Speed Packaging position in the Engineering field is open for applications.
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