Process Engineer ; Advanced Packaging Integration Technologist

At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible.
Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration.
The impact we have on the world is made possible by focusing on our people. So we recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities.
Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible.

Date:
Oct 15, 2026

Location:

Tualatin, OR, US, 97062

Worker Category:
On-site Flex

The Advanced Packaging Integration Group focuses on driving differentiated solutions from Lam to enable customer heterogeneous integration product and process roadmaps through orchestration of joint projects and integrated test vehicles with ecosystem partners including research institutes, consortia, universities, and peer companies. The Technology and Ecosystem Engagements Group enables a virtual integration center for Lam product groups and customer engagement teams to drive accelerated studies to understand and resolve challenging process integration problems and deliver unique and effective product solutions to meet future customer roadmaps.

In this role, you will directly contribute to expanding Lam Research's Advanced Packaging technology leadership and industry influence by leading and executing complex JDPs and research programs that create measurable business value across engineering, manufacturing, supply chain, and business operations. You will partner with engineers and leaders across multiple product groups and customer account teams across Lam as well as external ecosystem leaders to orchestrate a virtual integration center that enables faster decision-making, operational efficiency, innovation, and strengthens Lam's competitive advantage.

You will collaborate and generate integration flows that meet manufacturability and reliability requirements to drive novel technology development options. You will also represent Lam Research as a technology ambassador at industry conferences and symposiums, enhancing our vision and strategy of advancing technology through strong ecosystem collaborations.

• Subject matter expertise in logic and memory advanced packaging integration including 2D/2.5D/3D, WLP, HBM, etc.
• Ability to synthesize customer AP roadmap needs, generate process integration flow options, identify unit process challenges, and propose solution paths to enable highest possible product performance, yield, and reliability.
• Engage closely with PG engineering and customer account technologist teams on test vehicle needs for improved unit process development and characterization, help develop test vehicle flows.
• Study system-level co-optimization trends across different logic and memory product and process segments, identify emerging challenges and critical HW and process needs…