Director, Thermal Chain Technical Business Development

Job Description

The Director, Thermal Chain Technical Business Development leads Vertiv's pre-sales technical engagement for thermal management solutions across global strategic Hyperscale, Neo-Cloud, and MTDC customers. This is a critical role bridging deep thermal domain expertise with customer-facing influence to position Vertiv as the basis of design for cooling architectures in next-generation data centers.

The scope encompasses the full spectrum of thermal solutions — from traditional air-cooled systems (perimeter and in-row cooling) to advanced liquid cooling (direct-to-chip, rear-door heat exchangers, immersion cooling), economizer-based designs, and hybrid thermal architectures. As data center densification accelerates and AI/HPC workloads drive unprecedented heat loads, this role is at the forefront of defining how Vertiv addresses extreme density thermal challenges.

The Technical Business Development team positions Vertiv as a trusted partner through deep product and solution expertise, industry insight & leadership, and customer consultation to design solutions that meet customers' unique needs. The goal is to "get up and to the left" - engaging higher in the customer organization to the decision maker level and earlier in the process to position Vertiv as the basis of design.

The incumbent guides a team of thermal domain experts with credible technical capability and strong communication and influence skills. Strong collaboration and partnership with the Hyperscale, Neocloud, and MTDC account managers, data center solutions, power train, and whitespace solutions teams are critical to deliver a consistent and unified message to advance Vertiv's market position.

This position requires invention on a daily basis with a keen sense of urgency and market approach nimbleness. Today's data center customers expect speed and technical competence in addressing thermal challenges at scale - particularly as rack densities push beyond 100kW and liquid cooling becomes a baseline requirement.

• Thermal Basis-of-Design:
  Achievement of Vertiv thermal products/solutions as customer basis-of-design across cooling architectures (air, liquid, hybrid).
• Share-of-Wallet Penetration:
  Measurable orders & sales share gain for thermal solutions at target GSA customers.
• Thought Leadership:
  Collaboration with Thermal BU/Product Lines to develop reference cooling architectures and disseminate thermal thought leadership to customers, industry events, and market publications.
• Account Strategy:
  Collaboration with GSA and NAM Sales counterparts to define and execute thermal-specific growth strategies within overall account plans.
• Capability Maturity:
  Expansion of team capabilities; evolution from product-specific thermal skills to system-level thermal chain expertise integrated with overall data center architecture.

Customer Technical Engagement: