Applications Engineering, Sr Engineer

Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

You bring practical experience in semiconductor design with a strong foundation in power integrity, thermal integrity, or timing signoff. You have worked with tools like Red Hawk-SC, Prime Time, or Totem in production environments and understand what it takes to move a chip through signoff successfully.

You are comfortable working directly with customers, including highly technical experienced engineers. You listen well, ask the right questions, and know when to elevate to R&D versus solve the problem with existing capabilities. You can translate customer requirements into clear technical specifications that software teams can act on.

You bring a practical mindset to customer engagements. You understand that technical work must tie to business outcomes, and you balance depth with pragmatism. You are organized, self-directed, and able to manage multiple customer requests without losing track of priorities.

At Synopsys, you will support tier‑one accounts on problems that directly affect tape‑out schedules, working with a global team that values technical rigor and customer impact.

• Support key accounts on power integrity, thermal integrity, and signal integrity signoff
• Meet with customers multiple times a day to understand technical requirements, debug complex design issues, and deliver solutions that accelerate their tape‑out schedules
• Translate customer needs into clear technical requirements for internal R&D teams, writing specs that bridge the gap between electrical engineering and software development
• 3D‑IC power, multiphysics and thermal integrity signoff
• Deploy and validate new workflows and integrated capabilities, including IR‑aware timing flows and thermal‑aware design methodologies, in live customer environment
• Support both post‑sales deployments and pre‑sales engagements, helping customers adopt new tools and capabilities while ensuring existing workflows run smoothly
• Build internal expertise on classic Synopsys tools and workflows, contributing to knowledge sharing and cross‑training efforts as the team integrates Ansys and Synopsys capabilities
• Work with global engineering teams to align customer feedback with product roadmaps, ensuring that what you learn in the field shapes what gets built next

• Drive adoption of Synopsys and Ansys signoff tools at tier‑one accounts, expanding our footprint in markets that define the future of AI and high‑performance computing
• Help customers resolve complex power, thermal, timing, and reliability challenges that directly affect their ability to tape out on schedule
• Influence the evolution of industry‑leading EDA products by feeding real customer use cases and technical gaps back to R&D teams
• Strengthen customer relationships by acting as a trusted technical advisor who understands both the tools and the problems they are trying to solve
• Improve internal capability through knowledge sharing, documentation, and cross‑training as the team builds expertise across the combined Synopsys and Ansys portfolio

• Bachelor's degree in Electrical Engineering with at least 2 years of experience, or Master's degree in Electrical Engineering with at least 1 year of experience
• At least 1 year of hands‑on experience in semiconductor design with strong expertise in PDN/EMIR, static timing analysis, timing closure, thermal integrity, or ECO flows at block or SoC level
• Hands‑on experience with tools such as Red Hawk‑SC, Red Hawk‑SC Electro Thermal, Totem, Totem‑SC, Prime Time, or Prime Closure
• 3D‑IC architecture knowledge would be plus such as TSMC CoWoS‑L, interposer PDN design awareness
• Strong understanding of signoff flows including power integrity, thermal integrity, timing analysis, and reliability
• Ab…