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Job Description & How to Apply Below
As a key member of the Test Packaging Integration team, you will lead the design and implementation of optical packaging processes.
Your role emphasizes high-precision assembly and collaboration in a diverse team to optimize product performance and reliability.
Key Responsibilities:
• Develop and implement packaging processes for photonic devices
• Optimize alignment methods for improved efficiency
• Establish validation and characterization plans
• Collaborate on design for excellence methodologies
• Analyze assembly data to enhance stability and yield
Requirements:
• PhD or Master’s in physics or engineering
• 3+ years in photonic circuit packaging
• Proven experience in NPI and process optimization
• Strong teamwork and communication skills
• Detail-oriented problem-solving capabilities
Shape the future of quantum computing with your engineering expertise at Photonic.
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Position Requirements
10+ Years
work experience
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