Circularity Innovation Engineer: Packaging & Materials
Listed on 2026-10-16
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Engineering
Packaging Engineer, Materials Engineering, Process Engineer, Manufacturing Engineer
Hewlett Packard Co. seeks an experienced Circularity Innovation Engineer to lead end-to-end circularity projects across products and packaging, focusing on renewable materials, takeback, and product data systems.
You will drive design for circularity, scalability, and compliance within global supply chains. Role requires 8–12+ years in circular economy, packaging engineering, or sustainable materials, with cross-functional leadership and strong data proficiency.
We would love to welcome a new Circularity Innovation Engineer:
Packaging & Materials to our organisation in Vancouver, WA, United States.
This opportunity is for the Circularity Innovation Engineer:
Packaging & Materials role at Hewlett Packard Co.
We are seeking a motivated Circularity Innovation Engineer:
Packaging & Materials to join Hewlett Packard Co. in Vancouver, WA, United States.
Consider building your career as a Circularity Innovation Engineer:
Packaging & Materials at Hewlett Packard Co.
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