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Job Description & How to Apply Below
Join Teledyne Technologies as a Wafer Level Packaging Process Engineer to advance wafer bonding and manufacturing processes. Your expertise will be essential in achieving optimal yield and operational efficiency.
In this role within the Uncooled Detector team, you'll support the development and execution of wafer-level packaging processes. Successful candidates will have hands-on experience in wafer bonding techniques and a collaborative spirit to troubleshoot and resolve process challenges. You'll be integral in maintaining high standards in a supportive cleanroom environment.
Key Responsibilities:
• Own and sustain wafer bonding processes and tools
• Optimize and qualify bonding recipes for production
• Lead process characterization to enhance yield
• Partner with teams for tool qualification and upgrades
• Support capacity planning initiatives and manufacturing ramp
Requirements:
• Bachelor’s degree in relevant engineering discipline
• 1-3+ years of experience in semiconductor engineering
• Required US citizenship or PERM residency
• Strong analytical and problem-solving skills
• Experience training technical staff on bonding processes
Leverage your engineering expertise for impactful contributions at Teledyne in manufacturing excellence.
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