Sr. Member of Technical Staff - Process Integration

About Global Foundries:

Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

Summary of Role:

Global Foundries' Fab 9 is seeking professionals to support our 200mm semiconductor manufacturing and development facility in Essex Junction, VT. The core responsibilities of this team involve ownership of process integration of semiconductor devices; monitoring performance and driving improvements related to technology yield, Cp/Cpk of inline and electrical parameters, leading defectivity improvement, technology transfers and more. The ideal candidate can demonstrate a technical understanding of semiconductor principles and an understanding of a balanced scorecard approach to develop, sustain, and improve semiconductor technologies with quality, cost, and delivery all considered.

This is a 5/2 schedule (Mon-Fri), this role will be fully on site.

Essential Responsibilities:

• Identify and prioritize projects that align with strategic goals and objectives.
• Lead and coordinate a team of up to 5 staff to assess risk and execute tasks to achieve the objective.
• Exercise clear and concise communication of project status vs expected result.
• Sustain and improve manufacturing technologies through identification of risk and risk mitigation strategies that include reducing defectivity, improving process stability (Cp/Cpk), improving process control and improving processes / processing sequences.
• Detect and react to signals to support quality and delivery performance.
• Drive appropriate actions to stop, contain, address the cause, and drive disposition.
• Identify and drive cost reduction through improved yield, identify lower cost materials, simplified or improved process sequences, and migration to strategic platforms.
• Transfer of technologies into or out of the fabricator.
• Collaborate with technology development and process module teams to implement best practices into new technologies during development and qualification.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
• Other duties as assigned by manager / supervisor.

Required Qualifications:

• Bachelor of Science degree in science, math, engineering, semiconductor manufacturing or a related discipline.
• 10+ years of semiconductor engineering manufacturing experience.
• Some prior front end of line process integration experience.
• Project management skills / team leadership experience - i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Travel - Up to 10%.
• Fluency in English Language – both written & verbal.

Preferred Qualifications:

• Master’s degree in science, math, engineering, semiconductor manufacturing, or a related discipline.
• Broad understanding of FEOL device integration including shallow trench isolation, FET integration, NPN integration, diffusion, and interconnect levels.
• Working device physics understanding.
• Ability to analyze / characterize PCM and physical data in support of project identification and demonstration of improvement.
• Ability to apply principles of Statistical Process Control (SPC) and Design of Experiments (DOE).
• Strong structured problem-solving skills and experience.
• Knowledge of Lean Manufacturing principles.
• Ability to work effectively and efficiently with diverse teams.
• Strong leadership and communication skills.

Expected Salary Range: $ - $. The exact Salary will be determined based on qualifications, experience and location.