Head of -Gen Power Silicon & Packaging Innovation
Listed on 2026-11-05
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Engineering
Packaging Engineer, Systems Engineer, Electronics Engineer, Electrical Engineering
NXP Semiconductors NV seeks a Director of Advanced Power Silicon & Packaging Technology to shape the strategy and execution for next-generation power delivery across silicon, packaging, and system integration. You will partner with design, packaging, manufacturing, and product teams to push power efficiency, density, and reliability in AI, data center, and HPC platforms.
The role emphasizes leadership, IP creation, and collaborations with foundries, OSATs, EDA vendors, and research
The Head of Next-Gen Power Silicon & Packaging Innovation role at NXP Semiconductors NV is now open for applications in VA, United States.
The position is based in VA, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 200..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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