SiC Advanced Packaging Applications Engineer; .5D/3D HPC)
Listed on 2026-09-29
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Engineering
Packaging Engineer
Whatsupstateny is seeking an Applications Engineer for Advanced Packaging to provide pre- and post-sales technical support for integrating Wolfspeed SiC substrates into 2.5D/3D HPC and AI data-center packaging. You will bridge materials expertise with customer designs, guiding use-case identification, material selection, and design validation.
The ideal candidate has a strong background in semiconductor packaging, thermal simulation, and process integration, with excellent communication skills
We are seeking a motivated SiC Advanced Packaging Applications Engineer (2.5D/3D HPC) to join Whatsupstateny in United States.
Join Whatsupstateny and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the SiC Advanced Packaging Applications Engineer (2.5D/3D HPC) role at Whatsupstateny, based in United States.
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