Test Engineer

We are looking for a Munich based IC Test Engineer for our customer in Munich, Germany. This opportunity requires an onsite presence at the customer's site at least 3 days per week, every week. The role can be contract or contract to permanent.
Must have working rights for Germany or EU. Candidates available on a remote basis only will not be considered.

• Partner with design teams from early development stages to review DFX architecture and define comprehensive test requirements.
• Develop test methodologies and generate test content for high-speed embedded IP interfaces (LPDDR4/5, PCIe Gen4/5, MIPI D/C/MPHY).
• Perform test program development, pattern conversion, and pre‑silicon validation (virtual simulations).
• Support load board and probe card design.
• Lead post‑silicon debug to enable timely delivery of samples to internal and external customers.
• Drive test characterization and optimization to meet automotive quality standards.
• Collaborate with Quality & Reliability teams to execute qualification plans efficiently.
• Lead production test deployment with tier‑one foundries and OSATs for high‑volume wafer sort and final test operations.

• BSc or MSc in Electrical Engineering.
• 7+ years of experience in IC Product/Test Engineering.
• Proven hands‑on experience in bring‑up and productization of complex ICs.
• Experience with Teradyne Ultra Flex/Ultra Flex Plus  would be a strong advantage.
• Deep knowledge of structural DFT methodologies (Scan, MBIST, JTAG).
• Proficiency in C/C++ and scripting (Python, Perl) in a Unix environment.
• Strong data and yield analysis skills using statistical tools (e.g., JMP).
• Familiarity with Verilog and RTL simulations would be an advantage.

If this role is a match to your skillset, please email me for more information , along with your updated CV.

Principal Analog AMS RF Recruitment Specialist