Packaging Engineer - IC Packaging & Thermal Analysis
Listed on 2026-10-07
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Engineering
Packaging Engineer
Analog Devices, Inc. is seeking a senior-level packaging engineering professional to lead design, development, and qualification of advanced semiconductor packaging solutions.
The role focuses on wire-bond, flip-chip, and system-in-package platforms, with mechanical and thermal analysis guiding architecture choices and reliability planning. You will perform FEM simulations, collaborate with OSATs and suppliers, and drive process improvements to optimize yield and cost while maintaining robust
Are you ready to take on the Staff Packaging Engineer - IC Packaging & Thermal Analysis role at Analog Devices?
The Staff Packaging Engineer - IC Packaging & Thermal Analysis role at Analog Devices is now open for applications in Wilmington, MA, United States.
Join us at Analog Devices as our next Staff Packaging Engineer - IC Packaging & Thermal Analysis in Wilmington, MA, United States.
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