Semiconductor Packaging Engineer

About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers.

With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at  and on Linked In and X.Senior Systems Semiconductor Packaging Engineer About the Role As a Senior Systems Semiconductor Packaging Engineer, you will lead the development of advanced semiconductor packaging solutions for MEMS sensors used in automotive, industrial, medical, aerospace, and defense applications.

You will work across the product lifecycle, from concept through manufacturing readiness, helping translate product and customer requirements into robust, scalable packaging solutions.

This role calls for strong technical judgment, cross-functional collaboration, and hands-on problem solving. You will partner closely with teams across applications, quality, reliability, manufacturing, and external vendors to improve package performance, manufacturability, and time to market.

Key Responsibilities Packaging Development:

- Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness

Manufacturability and Reliability:

- Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving

Root Cause and Yield Improvement:

- Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions

Engineering Analysis:

- Perform detailed package analysis using 3D CAD tools such as Solid Works and simulation tools such as ANSYS to evaluate mechanical and process performance

Process and Quality Methods:

- Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes

Customer Requirements Translation:

- Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teamsOSAT

Collaboration:

- Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities

Vendor and Assembly Readiness:

- Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints

Cross-Functional Leadership:

- Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases

Required Skills Semiconductor Packaging Expertise:

- Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release

Materials Knowledge:

- Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging

Design for Reliability:

- Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization

Simulation and Analysis Tools:

- Hands-on experience with 3D CAD and engineering analysis tools such as Solid Works and ANSYSStructured Problem Solving:

- Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges

Cross-Functional Collaboration:

- Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams

Technical…