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3D IC Solutions Engineer – Package Design Engineer – EDA

Job in Wilsonville, Clackamas County, Oregon, 97070, USA
Listing for: Anysilicon
Full Time position
Listed on 2026-10-16
Job specializations:
  • Engineering
    Systems Engineer, Electronics Engineer, Hardware Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 190000 USD Yearly USD 120000.00 190000.00 YEAR
Job Description & How to Apply Below

Siemens EDA is a global leader in Electronic Design Automation, providing innovative solutions for electronic product development. We are looking for a motivated and experienced individual to join our 3D IC Solutions Engineering team as a package design lead, focusing on advanced 2.5 and 3D System in Package (SIP) designs.

Responsibilities:

  • Drive the development of workflows for physical design planning, layout, and verification of advanced 3D IC designs.
  • Manage package floor planning, functional/IO planning, interposer/substrate planning, and layout.
  • Oversee package level connectivity, Logical Equivalence Checking (LEC), and physical DRC/DFM verification of package components.
  • Collaborate with 3D IC Solutions teams to integrate workflows into the 3D IC Physical Design process.
  • Utilize reference designs and customer designs for workflow development, testing, and validation.
  • Provide technical support to sales and marketing design service organizations as needed.
  • Travel periodically to work with customers on workflow solutions.

Qualifications:

  • BS or MS in Electrical/Computer Engineering or equivalent.
  • Advanced experience in package physical design and verification.

Skills:

  • Experience with Advanced Packaging IC EDA tools and design methods, including 2.5D and 3D solutions.
  • Proficiency in package design tools such as Cadence (APD/SiP) and Siemens (XSI/XPD).
  • Knowledge of signal/power integrity analysis tools like Siemens (Hyper Lynx SI/PI) and Ansys (Redhawk, Totem).
  • Familiarity with EDA data formats (Verilog, LEF/DEF, GDS, OASIS).
  • Proficient in Windows and Linux operating systems.
  • Scripting/programming skills in Python, Tcl, Perl, or similar languages;
    Tk-based GUI development is a plus.
  • Understanding of ASIC design methodology from RTL synthesis to physical implementation phases.
  • Experience with physical verification (DRC, LVS, IR/EM analysis) and DFT integration.
  • Knowledge of thermal/stress analysis and optical design tools is a plus.
  • Competency in Microsoft Word, Excel, and PowerPoint.
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