3D IC Solutions Engineer – Package Design Engineer – EDA
Job in
Wilsonville, Clackamas County, Oregon, 97070, USA
Listed on 2026-10-16
Listing for:
Anysilicon
Full Time
position Listed on 2026-10-16
Job specializations:
-
Engineering
Systems Engineer, Electronics Engineer, Hardware Engineer
Job Description & How to Apply Below
Siemens EDA is a global leader in Electronic Design Automation, providing innovative solutions for electronic product development. We are looking for a motivated and experienced individual to join our 3D IC Solutions Engineering team as a package design lead, focusing on advanced 2.5 and 3D System in Package (SIP) designs.
Responsibilities:
- Drive the development of workflows for physical design planning, layout, and verification of advanced 3D IC designs.
- Manage package floor planning, functional/IO planning, interposer/substrate planning, and layout.
- Oversee package level connectivity, Logical Equivalence Checking (LEC), and physical DRC/DFM verification of package components.
- Collaborate with 3D IC Solutions teams to integrate workflows into the 3D IC Physical Design process.
- Utilize reference designs and customer designs for workflow development, testing, and validation.
- Provide technical support to sales and marketing design service organizations as needed.
- Travel periodically to work with customers on workflow solutions.
Qualifications:
- BS or MS in Electrical/Computer Engineering or equivalent.
- Advanced experience in package physical design and verification.
Skills:
- Experience with Advanced Packaging IC EDA tools and design methods, including 2.5D and 3D solutions.
- Proficiency in package design tools such as Cadence (APD/SiP) and Siemens (XSI/XPD).
- Knowledge of signal/power integrity analysis tools like Siemens (Hyper Lynx SI/PI) and Ansys (Redhawk, Totem).
- Familiarity with EDA data formats (Verilog, LEF/DEF, GDS, OASIS).
- Proficient in Windows and Linux operating systems.
- Scripting/programming skills in Python, Tcl, Perl, or similar languages;
Tk-based GUI development is a plus. - Understanding of ASIC design methodology from RTL synthesis to physical implementation phases.
- Experience with physical verification (DRC, LVS, IR/EM analysis) and DFT integration.
- Knowledge of thermal/stress analysis and optical design tools is a plus.
- Competency in Microsoft Word, Excel, and PowerPoint.
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