Hybrid DIC Packaging Applications Engineer
Job Description & How to Apply Below
Location: Town of Texas
A leading global technology company is seeking an Application Engineer focused on 2.5D/3D IC packaging. The role involves driving technical engagements with customers, providing solutions for their challenges, and collaborating with R&D teams. The ideal candidate will have experience in Signal Integrity, Power Integrity, and Electromagnetics.
This role offers flexibility, competitive compensation, and diverse benefits while allowing the candidate to make an impact in the industry.
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