Lead Power Package Design Engineer; SiP/Flip-Chip
Listed on 2026-10-14
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Engineering
Electronics Engineer, Electrical Engineering
Location: Town of Texas
Renesas Electronics Corp. in Wisconsin is seeking a senior package technology professional to lead R&D, NPIs, and OSAT management for advanced power packaging solutions.
You will focus on Smart Power Stages, Vertical Power Stages, Power Modules and Discrete FET packages, including SiC/GaN and other interconnects, with extensive DOE and process qualification. The role requires 15–20 years of experience and a PhD/MS/Bachelor in related field, and collaboration with product, reliability, quality to
We are currently recruiting a Lead Power Package Design Engineer (SiP/Flip-Chip) for our team in Town of Texas, WI, United States.
As a Lead Power Package Design Engineer (SiP/Flip-Chip), you will play an important part at Renesas Electronics Corp. in Town of Texas, WI, United States.
We invite applications for the Lead Power Package Design Engineer (SiP/Flip-Chip) position located in Town of Texas, WI, United States.
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