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Semiconductor Process Engineer (Die Bonding) | Up to $6k / 5 days | 0580
Job in
Woodlands, Singapore
Listed on 2026-08-04
Listing for:
THE SUPREME HR ADVISORY PTE. LTD.
Full Time
position Listed on 2026-08-04
Job specializations:
-
Engineering
Process Engineer
Job Description & How to Apply Below
- Working
Location:
Woodlands - Working Days:
Monday – Friday - Working Hours:
9:00am
-6:00pm - Starting Salary: $3,000 to $6,000
- Lead the
design, development, optimization, and validation
of software and hardware applications for advanced die bonding processes. - Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on
process optimization and application performance
. - Conduct
troubleshooting and failure analysis
of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability. - Perform
machine setup, calibration, and alignment
to ensure optimal process performance, repeatability, and yield. - Develop
test procedures, application recipes
, and documentation for process qualification and validation; maintain detailed logs and technical reports. - Collaborate withR&D, software, mechanical, electrical, quality
, and manufacturing teams to address technical challenges and implement design or process improvements. - Provide
on-site support
for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities. - Serve as a key interface between
customers and the R&D team
, delivering user feedback to guide tool enhancements and feature development.
- Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
- 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
- Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
- Experience with semiconductor equipment integration, motion control systems, and process development.
- Hands‑on troubleshooting and problem‑solving skills in a high‑tech manufacturing or lab environment.
- Willingness to travel for customer support and on‑site installations (as required).
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