Process Engineer

Application / Process Engineer (Die Bond Tools)

$3,000 – $6,000

9am – 6pm (Mon to Fri)

Woodlands

• Develop, optimize and qualify die bonding applications, processes and equipment.
• Set up, calibrate and align machines, and develop process recipes and test procedures.
• Troubleshoot equipment and process issues, perform root cause analysis and implement corrective actions.
• Support process improvement, yield enhancement and cycle-time optimization.
• Work closely with R&D, Software, Mechanical, Electrical, Manufacturing and Quality teams.
• Provide technical support, installation and application assistance at customer sites.
• Conduct customer training and provide technical support to Field Application Engineers.
• Gather customer feedback and work with R&D on product and process improvements.

• Diploma or Degree in Mechanical, Mechatronics, Electrical/Electronics, Materials, Manufacturing, Automation or related Engineering disciplines.
• Minimum 2 years of relevant experience in semiconductor equipment, automation, advanced packaging or precision manufacturing.
• Experience in one or more of the following:
  Die Bonding/Die Attach, Flip-Chip, Wire Bonding, SMT, Wafer Handling, Semiconductor Automation, Precision Robotics or Advanced Packaging.
• Hands‑on experience in machine setup, calibration, troubleshooting, parameter adjustment and recovery.
• Knowledge of precision motion systems, servo systems, sensors, vacuum, pneumatics and tooling.
• Experience with vision/alignment or precision positioning systems is advantageous.
• Experience with process engineering and data analysis, such as DOE, SPC, Cp/Cpk, GR&R, process qualification or machine capability studies.
• Familiar with structured problem‑solving and RCA methods such as 5-Why, Fishbone, 8D, DOE or FMEA.
• Willing to travel to customer sites when required.