Process Engineer - Thin film technology; m​/f

Responsibilities:

• Dry etching of GaAs and InP based materials by ICP‑RIE
• Dry etching of dielectric materials and metals by (ICP‑) RIE
• Deposition processes like PECVD and ALD for dielectrics, sputtering and evaporation for metals
• Thermal processes like curing, annealing, alloying, and oxidation
• Drive continuous improvements of product performance, process control, yield, and cost efficiency
• Analyze and document results and share findings and information with stakeholders
• Develop and implement new processes in collaboration with R&D
• Prepare and maintain work instructions and train operators and engineers
• Coordinate and support maintenance and unscheduled equipment repairs, daily troubleshooting
• Engage with tool suppliers to address process requirements, evaluate upgrades or new equipment solutions, and qualify them for production

• Technology based Master or PhD with focus on semiconductor processing
• Practical experience in at least some topics like dry etching, thin film deposition, oxidation, curing, and other thermal processes
• Familiar with high volume semiconductor manufacturing processes
• Understanding of SPC and DoE
• Ability to work independently as well as to collaborate with operators, technicians and engineers
• Strong verbal and written technical communication skills, preferably in German and English
• Result oriented, hands‑on personality with initiative and a can‑do attitude

• A dynamic, international environment
• An appreciative, collegial corporate culture
• Unique technical challenges for the products of the day after tomorrow
• Above‑average social benefits