Chip Assembly Die Bonding Process Engineer; m​/f​/d

Coherent is a global leader in photonics, developing advanced laser, optical and materials technologies that enable semiconductor manufacturing, AI infrastructure, advanced communications and precision industrial applications worldwide.

Join our semiconductor manufacturing team as a Chip Assembly Process Engineer, where you will take ownership of critical chip assembly processes including die bonding, curing, marking, and inspection. This is a hands‑on engineering role focused on developing and optimizing manufacturing processes, improving yield and quality, introducing new products into production, and ensuring the reliability of advanced assembly equipment. Working closely with R&D, production, quality, and suppliers, you will play a key role in bringing innovative technologies from development into high-volume manufacturing.

• Own and continuously improve chip assembly processes, including die bonding, curing, marking, and inspection.
• Develop, qualify, and implement die‑bonding processes for new product designs and manufacturing requirements.
• Define inspection methods, acceptance criteria, and equipment qualifications to ensure assembly quality and process control.
• Analyze process performance, identify root causes of deviations, and implement corrective actions to improve yield, quality, throughput, and cost.
• Collaborate with R&D to transfer new technologies and products into manufacturing.
• Take technical responsibility for die‑bonding equipment, including hands‑on troubleshooting, optimization, and preventive maintenance support.
• Work closely with equipment suppliers to evaluate, qualify, and introduce new tools and process improvements.
• Prepare and maintain process documentation, work instructions, and training materials for operators and engineers.
• Support manufacturing operations in a cleanroom environment and provide technical expertise to production teams.

• Bachelor's or Master's degree in Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, Mechatronics, or a related discipline.
• 1-3 years of hands‑on experience in die bonding, semiconductor assembly, or a similar precision manufacturing environment.
• Strong understanding of manufacturing processes, process control, and quality improvement methodologies.
• Experience with process troubleshooting, root cause analysis, and data‑driven decision making.
• Knowledge of SPC, DoE, and other structured process improvement tools.
• Experience working with automated manufacturing equipment and production processes.
• A hands‑on approach with a passion for solving technical challenges and working directly with manufacturing equipment.
• Strong collaboration and communication skills, with the ability to work effectively across engineering, production, and supplier teams.
• Excellent English communication skills. German language skills are beneficial but not essential.
• Experience in a cleanroom environment, programming, equipment software, soldering processes, or Lean Six Sigma methodologies would be advantageous.

• Work on advanced semiconductor manufacturing technologies in a highly technical environment.
• Take ownership of both process development and production equipment.
• Collaborate closely with R&D to bring innovative products into production.
• Be part of an international team that values technical excellence, continuous improvement, and professional growth.
• Competitive salary, comprehensive benefits, and long-term career development opportunities.

Our benefits vary by country and role. Depending on your location, your package may include:

• Competitive base salary and annual incentive eligibility
• Employer-supported pension or retirement…