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Thermal Mechanical Engineer

Job in Agoura Hills, Los Angeles County, California, 91375, USA
Listing for: Teradyne
Full Time position
Listed on 2026-09-26
Job specializations:
  • Engineering
    Mechanical Engineer, Test Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 79800 - 127600 USD Yearly USD 79800.00 127600.00 YEAR
Job Description & How to Apply Below

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Thermal Mechanical Engineer (Teradyne, Agoura Hills, CA)

Date: Aug 29, 2026

Location: Agoura Hills, CA, US

We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!

We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive.

Our Purpose

TERADYNE, where experience meets innovation and drives excellence in every connection. We are fueled by creativity and diverse perspectives across our workforce. Our employees are supportedto innovateandlearnsomething new every day.

We cultivate a culture of inclusion that respects individual strengths, viewpoints, and experiences because better teams deliver better outcomes.

Opportunity Overview

Teradyne is expanding its centralized mechanical engineering capability in Agoura Hills to support next-generation semiconductor test equipment. As a Thermal Mechanical Engineer, you will help design, analyze, prototype, integrate, andvalidatethe thermal and mechanical systems that enable high-performance semiconductor test platforms used across computing, communications, mobility, and AI infrastructure.

This development-focused role is well suited for an engineer ready to build depth in liquid cooling, board-level thermal analysis, thermal-mechanical hardware, and hands‑on validation while working with experienced technical leaders.

Support development of board-level and system-level cooling solutions for next-generation semiconductor test equipment

Contribute to cold plate, liquid-cooled component , fluid connector, heatsink, and thermal-mechanical hardware design

Create and revise mechanical models and drawings using SOLIDWORKS

Support thermal analyses, prototype evaluations, design verification, and thermal testing activities

Assist with liquid delivery hardware, including pumps, filters, piping, fittings, and cooling loops

Document technical findings clearly and participate in design reviews with cross‑functional engineering teams

All About You

We seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If you are ready to join us in this mission, take a closer look at the minimum criteria for the position.

Bachelor's degree in Mechanical Engineering or related discipline

Typically 2+ years of related thermal, mechanical, or product development experience, or an advanced degree with relevant project experience

Strong foundation in heat transfer, fluid mechanics, thermal analysis, or thermal‑mechanical design

Exposure to board‑level thermal analysis, liquid cooling, cooling hardware, or thermal testing

SOLIDWORKS experience required ; PDM or similar data‑management exposure preferred

Clear communication, documentation, teamwork, and problem‑solving skills

Proactive, hands‑on mindset with the ability to ramp quickly, take ownership of assigned work, and collaborate across engineering teams

Preferred

Experience with semiconductor test equipment, capital equipment, or high‑density electronics systems

Experience with cold plates, liquid cooling systems, cooling distribution hardware, or fluid connector integration

Exposure to CFD or thermal analysis tools…

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